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美国Azimuth测试座代理商

2015/6/11

我公司授权代理Azimuth公司全系列产品,美国Azimuth电子集团公司致力于为自动化、商业、医疗、电子和通信行业提供与之匹配的最先进的夹具制造方案。通过集成回路,无铅芯片载体单元,多芯片单元,阵列及芯片封装技术为电子行业领域提供夹具管、晶体管和微型组件。早在上个世纪80年代初,Azimuth的高速集成电路就已由达到0.020英寸标准的电流接触器和载波系统及0.50毫米的铅芯设计而成。现在在极大与极小的封装内我们可以实现更高的I.O计数,更快的测试速度和更长的接触寿命。

Dual Flatpack Package(DFP封装),Fiber Optic / Laser Diodes(用于半导体激光器的蝶形封装),Leaded Chip Carrier(LCC超大间隔芯片载体),Land Grid Array /Ball Grid Array (LGA封装),Leadless Chip Carrier(LLCC无铅芯片载体),Multi Chip Module /High Density Interconnect(MCM多芯片组件及高密度连接),Plug-in (Plug-in插件),Power Hybrid Modules(Power Hybrid功率混合微膜组件),Quad Flatpack Package(QFP封装),Small Outline Integrated Circuit(SOIC小型集成电路),Stack Flatpack Package,LIF Socket for 16 pin TO devices,Socket for microwave packages with pads,Zero Insertion Force Socket for medical device with leads,Zero Insertion Force Socket for 225 PGA devices,Socket for substrate with pads,Socket for high frequency testing,Kelvin LIF Socket for TO devices,High Temperature Burn-in Socket with option Heat Sink,Socket for RF devices with pads,Socket for Micro-BGA devices,Test Socket for two-sided medical device with pads,Burn-in Socket for two-sided medical device with pads.Azimuth socket,Azimuth test socket.